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1. Polymer Waveguides for Co-Packaged Optics NSTL国家科技图书文献中心

Yi Shen | Michael Gallagher ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 1683～1686 - 共4页

摘要：This paper demonstrates a low-loss photo | patternable polymer waveguide material platform based on | benzocyclobutene (BCB) that works in both liquid resins and dry | film formats. By precise control of molecule design | and refractive index between the core and clad

关键词： Optical losses | Optical interconnections | Optical device fabrication | Waveguide lasers | Optical variables control | Optical imaging | Optical refraction

2. Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability NSTL国家科技图书文献中心

Byoungdo Lee | Jinwoo Choi ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 643～646 - 共4页

摘要：2.5D body size is expanding due to SoC/HBM | system integration to maximize artificial intelligence | (AI) performance. Accordingly, thermal and | mechanical stress caused by large body size is also | increasing. In this paper, we performed a process and

关键词： Degradation | System-in-package | Thermal resistance | Bandwidth | Reliability | Artificial intelligence | Stress

3. Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages NSTL国家科技图书文献中心

Jannik Koch | Levin Marten Brinkma...... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 193～200 - 共8页

摘要：Hermetic Packages are of great importance for | the recent miniaturization of quantum systems to | secure a defined vacuum and gas species. In this work | , a silicon membrane pressure sensor based on | platinum strain gauge structures to measure the pressure

关键词： Pressure sensors | Bridges | Sensitivity | Sensor phenomena and characterization | Strain measurement | Silicon | Pressure measurement

4. Additive Manufacturing of a mmWave Microstrip Leaky Wave Antenna on Thin Alumina Substrate NSTL国家科技图书文献中心

Ethan Kepros | Yihang Chu ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 1742～1745 - 共4页

摘要：This work demonstrates a novel process to | fabricate a mmWave aerosol jet printed leaky wave antenna | on an alumina substrate. While many variations of | leaky wave antenna have been presented, most have been | on conventional substrates such as FR4 or Rogers

关键词： Temperature measurement | Antenna measurements | Resistance | Three-dimensional displays | Aerosols | Leaky wave antennas | Electrical resistance measurement

5. 0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer NSTL国家科技图书文献中心

Kai Ma | Nikolaos Bekiaris ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 331～336 - 共6页

摘要：3D integration by adopting wafer-to-wafer (W2W | ) or chip-to-wafer (C2W) direct bonding techniques | scales up interconnect density. Heterogenous | integration enabled by direct bonding technology brings | wafers or chips with different functionalities into

关键词： Temperature distribution | Annealing | Three-dimensional displays | Films | Random access memory | Surface topography | Bonding

6. Quantifying Uncertainties in the Correlation of Simulations and Measurements Using the IEEE EPS Packaging Benchmark Suite NSTL国家科技图书文献中心

Jonatan Aronsson | Kemal Aygün - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 1677～1682 - 共6页

摘要：This study presents a novel methodology that | enhances the correlation between electromagnetic | simulations and measurements by introducing uncertainty | quantification and sensitivity analysis. It compares the Monte | Carlo method with Polynomial Chaos Expansions and

关键词： Analytical models | Uncertainty | Correlation | Sensitivity analysis | Measurement uncertainty | Benchmark testing | Packaging

7. Modeling and Optimization of Thermal Cycling Performance to Reduce Ratcheting-Induced Passivation Cracking in High-Voltage Power Modules NSTL国家科技图书文献中心

Liangbiao Chen | Yong Liu - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 215～220 - 共6页

摘要：Passivation thin film overlaying a metal layer | is a typical structure in power electronics. When a | package is subject to thermal cycling conditions | , plastic strains could accumulate in the metals after | each cycle, eventually causing stress relaxation and

关键词： Sensitivity analysis | Metals | Electronic packaging thermal management | Power electronics | Finite element analysis | Plastics | Stress

8. Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors NSTL国家科技图书文献中心

Stéphan Borel | Myriam Assous ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 771～777 - 共7页

摘要：We developed 1x6μm copper TSV with improved | performances in terms of electrical resistance and isolation | compared to our formerly published 1x10 μm HD TSV. This | was possible thanks to an optimized thinning process | that enabled us reducing the substrate thickness down

关键词： Resistance | Head | Scattering | Silicon | Real-time systems | Pressure measurement | Through-silicon vias

9. A Novel DC-DC Converter Module Using the integrated Package Solution (iPaS) Substrate for Next Generation High Performance Computing (HPC) Applications NSTL国家科技图书文献中心

Shuhei Yamada | Nobuyoshi Adachi ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 1060～1063 - 共4页

摘要：A novel DC-DC converter module with low | profile, good transient response and high efficiency has | been developed by utilizing an extremely advanced | substrate called integrated Package Solution (iPaS) with | embedded capacitors specialized for power delivery

关键词： Transient response | Power demand | High performance computing | Capacitors | DC-DC power converters | Packaging | Inductors

10. Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC-eSiFO) Package NSTL国家科技图书文献中心

Zhou Yang | Yuchi Yang ... - 《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 - IEEE Electronic Components and Technology Conference - 2024, - 2280～2285 - 共6页

摘要：As Moore’s Law tends to reach its limits | , shrinking process technology nodes is no longer the most | effective way to improve the performance of systems, and | more attention is being focused on advanced packaging | . Thermal dissipation as the main issue severely limits

摘要：This paper demonstrates a low-loss photo | patternable polymer waveguide material platform based on | benzocyclobutene (BCB) that works in both liquid resins and dry | film formats. By precise control of molecule design | and refractive index between the core and clad

关键词： Optical losses | Optical interconnections | Optical device fabrication | Waveguide lasers | Optical variables control | Optical imaging | Optical refraction

摘要：2.5D body size is expanding due to SoC/HBM | system integration to maximize artificial intelligence | (AI) performance. Accordingly, thermal and | mechanical stress caused by large body size is also | increasing. In this paper, we performed a process and

关键词： Degradation | System-in-package | Thermal resistance | Bandwidth | Reliability | Artificial intelligence | Stress

摘要：Hermetic Packages are of great importance for | the recent miniaturization of quantum systems to | secure a defined vacuum and gas species. In this work | , a silicon membrane pressure sensor based on | platinum strain gauge structures to measure the pressure

关键词： Pressure sensors | Bridges | Sensitivity | Sensor phenomena and characterization | Strain measurement | Silicon | Pressure measurement

摘要：This work demonstrates a novel process to | fabricate a mmWave aerosol jet printed leaky wave antenna | on an alumina substrate. While many variations of | leaky wave antenna have been presented, most have been | on conventional substrates such as FR4 or Rogers

关键词： Temperature measurement | Antenna measurements | Resistance | Three-dimensional displays | Aerosols | Leaky wave antennas | Electrical resistance measurement

摘要：3D integration by adopting wafer-to-wafer (W2W | ) or chip-to-wafer (C2W) direct bonding techniques | scales up interconnect density. Heterogenous | integration enabled by direct bonding technology brings | wafers or chips with different functionalities into

关键词： Temperature distribution | Annealing | Three-dimensional displays | Films | Random access memory | Surface topography | Bonding

摘要：This study presents a novel methodology that | enhances the correlation between electromagnetic | simulations and measurements by introducing uncertainty | quantification and sensitivity analysis. It compares the Monte | Carlo method with Polynomial Chaos Expansions and

关键词： Analytical models | Uncertainty | Correlation | Sensitivity analysis | Measurement uncertainty | Benchmark testing | Packaging

摘要：Passivation thin film overlaying a metal layer | is a typical structure in power electronics. When a | package is subject to thermal cycling conditions | , plastic strains could accumulate in the metals after | each cycle, eventually causing stress relaxation and

关键词： Sensitivity analysis | Metals | Electronic packaging thermal management | Power electronics | Finite element analysis | Plastics | Stress

摘要：We developed 1x6μm copper TSV with improved | performances in terms of electrical resistance and isolation | compared to our formerly published 1x10 μm HD TSV. This | was possible thanks to an optimized thinning process | that enabled us reducing the substrate thickness down

关键词： Resistance | Head | Scattering | Silicon | Real-time systems | Pressure measurement | Through-silicon vias

摘要：A novel DC-DC converter module with low | profile, good transient response and high efficiency has | been developed by utilizing an extremely advanced | substrate called integrated Package Solution (iPaS) with | embedded capacitors specialized for power delivery

关键词： Transient response | Power demand | High performance computing | Capacitors | DC-DC power converters | Packaging | Inductors

摘要：As Moore’s Law tends to reach its limits | , shrinking process technology nodes is no longer the most | effective way to improve the performance of systems, and | more attention is being focused on advanced packaging | . Thermal dissipation as the main issue severely limits

关键词： Manifolds | Fabrication | Wafer bonding | Three-dimensional displays | Cooling | Packaging | Silicon

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